Industrial Machinery - Company Ranking(43 companies in total)
Last Updated： Aggregation Period:Feb 25, 2026〜Mar 24, 2026
This ranking is based on the number of page views on our site.
Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
Stack-type heating furnace, curing furnace, drying furnace, inline heating furnace.
50 million yen-100 million yen |
【Specifications】 ■Equipment Configuration: Heating furnace + In-device transport *Standalone heating furnace also available ■Operating Tempe... | 【Applications】 ■ Heat-curing adhesive coating and curing automatic line (automotive electronic component assembly) ■ Underfill coating and c... | |
High-precision semi-auto FC bonder 'CB-700 (Athlete FA model)'
50 million yen-100 million yen |
【Specifications】 ■Supported Processes ・ACF/ACP ・NCF/NCP ・Au-Sn (Eutectic) ・Au-Au (Ultrasonic) ・Solder Bump ・Ag Sintering ■Mounting Acc... | 【Applications】 ■Various packages for MEMS, 5G, data communication, millimeter-wave sensors, photonics, AR fields, etc. ■Customized with a va... | |
High-precision flip chip bonder "Athlete FA (manufactured by Asurito Co., Ltd.)"
50 million yen-100 million yen |
■Specifications Board dimensions 5 to 100 mm x 5 to 235 mm Chip size □1 to 20 mm Mounting accuracy XYZ ±1μm (3σ) | Process ● ACF/ACP ● NCF/NCP ● Au-Sn (eutectic) ● Au-Au (ultrasonic) ● Solder bump Chip types ● Large chip - CMOS image sensor ● Fine pitch ... | |
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日精 本社
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- Featured Products
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Stack-type heating furnace, curing furnace, drying furnace, inline heating furnace.
- overview
- 【Specifications】 ■Equipment Configuration: Heating furnace + In-device transport *Standalone heating furnace also available ■Operating Tempe...
- Application/Performance example
- 【Applications】 ■ Heat-curing adhesive coating and curing automatic line (automotive electronic component assembly) ■ Underfill coating and c...
High-precision semi-auto FC bonder 'CB-700 (Athlete FA model)'
- overview
- 【Specifications】 ■Supported Processes ・ACF/ACP ・NCF/NCP ・Au-Sn (Eutectic) ・Au-Au (Ultrasonic) ・Solder Bump ・Ag Sintering ■Mounting Acc...
- Application/Performance example
- 【Applications】 ■Various packages for MEMS, 5G, data communication, millimeter-wave sensors, photonics, AR fields, etc. ■Customized with a va...
High-precision flip chip bonder "Athlete FA (manufactured by Asurito Co., Ltd.)"
- overview
- ■Specifications Board dimensions 5 to 100 mm x 5 to 235 mm Chip size □1 to 20 mm Mounting accuracy XYZ ±1μm (3σ)
- Application/Performance example
- Process ● ACF/ACP ● NCF/NCP ● Au-Sn (eutectic) ● Au-Au (ultrasonic) ● Solder bump Chip types ● Large chip - CMOS image sensor ● Fine pitch ...
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日精 本社
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